Huawei to Launch New AI SSD Product, Reshaping the AI Storage Market

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Huawei AI SSD

Key Points

Huawei (华为) is set to launch a new AI Solid State Drive (SSD) product on August 27, 2025, aiming to reshape China’s AI memory market.
This AI SSD is designed to address the demand for immense capacity and superior performance in AI training, inference, and large language model deployment, complementing or challenging HBM’s high bandwidth.
The launch is expected to create significant shifts for suppliers in various sectors, including storage equipment, main control chips, and cooling technologies.
Companies like Netcom Technology (朗科科技), a core SSD supplier accounting for 12% of Huawei’s (华为) storage procurement, and Biwin Storage Technology (佰维存储), which has enterprise-grade SSDs that passed Ascend certification, are positioned to benefit.

Huawei’s Upcoming AI SSD Set to Challenge HBM’s Dominance in AI Storage

Huawei (Huaweim 华为) is poised to unveil a groundbreaking Artificial Intelligence (AI) Solid State Drive (SSD) product on August 27, 2025.

This launch is anticipated to significantly alter the landscape of China’s AI memory market.

High Bandwidth Memory (HBM) currently holds a prominent position in the AI memory sector.

HBM is an advanced memory technology that achieves extremely high data transfer bandwidth through 3D stacking and ultra-wide interfaces, typically integrated directly into Graphics Processing Unit (GPU) cards.

However, HBM’s design prioritizes extreme bandwidth and energy efficiency over capacity.

That trade-off often results in limited HBM capacity on existing computing cards.

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Key Differences: HBM vs. Huawei AI SSD
Feature	High Bandwidth Memory (HBM)	Huawei AI SSD
Primary Focus	Extreme Bandwidth & Energy Efficiency	Immense Capacity & Superior Performance for AI Workloads
Integration	Integrated directly into GPU cards	Likely external/system-level storage; complements or challenges HBM
Capacity	Limited capacity per computing card	Prioritizes higher capacity at lower cost per terabyte
Target Use Cases	Tasks requiring ultra-high data transfer rates (e.g., real-time GPU processing)	AI training, inference processes, large language model deployment, data locality

Addressing AI’s Demanding Storage Needs

The new AI SSD product from Huawei (Huaweim 华为) is designed to effectively meet the demand for immense capacity and superior performance required during AI training and inference processes.

It is expected to facilitate AI training, inference, and the deployment of large language models.

This strategic move aims to strengthen Huawei’s (Huaweim 华为) competitive edge in the AI era and foster the development of a localized storage ecosystem.

Huawei (Huaweim 华为) reportedly plans to collaborate with integrated machine manufacturers to disrupt the current market situation, injecting new vitality and possibilities into the AI storage market.

Potential Impact on Related Industries

Industry observers suggest that Huawei’s (Huaweim 华为) new AI SSD product could trigger significant shifts across several related sectors, including storage equipment, main control chips, and cooling technologies.

Several companies are being watched closely for their potential involvement or benefit from this development:

Storage Equipment Suppliers:

Netcom Technology (Langke Keji 朗科科技): Identified as a core SSD supplier for Huawei’s (Huaweim 华为) Ascend AI servers, reportedly accounting for 12% of Huawei’s (Huaweim 华为) storage procurement.
Their self-developed compute-in-memory main control chip is said to reduce latency by 80%, suitable for high-frequency data interaction in large AI models.
Biwin Storage Technology (Baiwei Cunzhu 佰维存储): A patent licensee for Huawei’s (Huaweim 华为) NM cards.
Their enterprise-grade SSDs have passed Ascend certification, with orders reportedly surging by 200% month-on-month.
They have also launched high-performance products like high-frequency DDR5 memory modules and PCIe 5.0 SSDs for AI PCs, aligning with Huawei’s (Huaweim 华为) AI SSD architecture.
Longsys (Jiangbolong 江波龙): Holds a leading market share in enterprise-grade SSD modules, with data center orders exceeding 25%.
Their proprietary main control chips reportedly reduce costs by 18%.
Their storage modules have passed Huawei’s (Huaweim 华为) compatibility certification and are used in Huawei (Huaweim 华为) data center backup storage.

Main Control Chip Manufacturers:

Maxio Technology (Lianyun Keji 联芸科技) (not yet listed, affiliated with Montage Technology): A leading domestic SSD main control chip provider, covering consumer, industrial, and enterprise-grade applications.
Huawei’s (Huaweim 华为) AI SSD is expected to utilize their main control solution, supporting 36-layer Die-on-Base (DOB) technology.
Montage Technology (Lanqi Keji 澜起科技): With its PCIe 5.0 main control, Montage is an indirect beneficiary.
Goke Microelectronics (Guoke Wei 国科微): Launched China’s first fully independent solid-state drive main control chip, GK2302, featuring domestic embedded CPU IP cores, meeting indigenous security requirements, and currently undergoing testing by Huawei’s (Huaweim 华为) supply chain.

Cooling Technology Providers:

Hongda Electronics (Hongda Dianzi 宏达电子): Supplies ceramic capacitor cooling solutions for Huawei (Huaweim 华为) SSDs, addressing heat management challenges during high-frequency interactions.
Their solutions reportedly improve yield by 15% and offer superior performance stability in high-temperature environments, suitable for high-power AI SSDs.
Fearonda (Feirongda 飞荣达): A key supplier of server cooling solutions for Huawei (Huaweim 华为), with liquid cooling technology spanning data center applications.
If AI SSDs adopt high-density packaging, Fearonda’s (Feirongda 飞荣达) cooling solutions are expected to find extended application.

Distribution and Service Companies:

Topwise Information (Tuowei Xinxi 拓维信息): General agent for Huawei’s (Huaweim 华为) enterprise business.
Its subsidiary, Jinhuawei (Jinhuawei 金华威), exclusively distributes Ascend AI training and inference integrated machines and OceanStor storage equipment, providing a significant channel advantage.
Silver Lining Investment (Yinxin Keji 银信科技): A primary distributor for Huawei (Huaweim 华为) storage, with a maintenance service gross profit margin of 35% and an 80% coverage among financial/telecom customers, poised to benefit from the enterprise-grade SSD replacement trend.

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Key Beneficiaries of Huawei’s AI SSD Launch
Company	Category	Key Contribution/Benefit
Netcom Technology (朗科科技)	Storage Equipment Supplier	Core SSD supplier for Huawei’s Ascend AI servers (12% of procurement), compute-in-memory chip reduces latency by 80%.
Biwin Storage Technology (佰维存储)	Storage Equipment Supplier	Patent licensee for Huawei NM cards, enterprise-grade SSDs passed Ascend certification (orders +200% MoM).
Longsys (江波龙)	Storage Equipment Supplier	Leading market share in enterprise SSD modules, proprietary main control chips reduce costs by 18%, Huawei-compatible.
Maxio Technology (联芸科技)	Main Control Chip Manufacturer	Leading domestic SSD main control chip provider, expected to be utilized by Huawei AI SSD.
Goke Microelectronics (国科微)	Main Control Chip Manufacturer	Launched China’s first independent SSD main control chip, currently testing with Huawei supply chain.
Hongda Electronics (宏达电子)	Cooling Technology Provider	Supplies ceramic capacitor cooling solutions for Huawei SSDs, improves yield by 15%, stable in high temperatures.
Fearonda (飞荣达)	Cooling Technology Provider	Key supplier of server cooling solutions for Huawei, liquid cooling technology, relevant for high-density AI SSDs.
Topwise Information (拓维信息)	Distribution and Service Company	General agent for Huawei enterprise business, exclusive distribution of Ascend AI machines & OceanStor storage.
Silver Lining Investment (银信科技)	Distribution and Service Company	Primary distributor for Huawei storage, high maintenance service margins, 80% coverage among financial/telecom customers.

Why this move matters

Capacity vs. bandwidth: HBM provides extremely high bandwidth but limited capacity, while SSDs prioritize higher capacity at lower cost per terabyte.

For AI training and large language model deployment, capacity and data locality can be as important as raw bandwidth.

That makes an AI-optimized SSD a natural complement — and potential challenger — to HBM in specific workloads.

Supply-chain ripple effects: If Huawei’s (Huaweim 华为) AI SSD gains traction, suppliers across storage, main control chips, cooling, and distribution could see meaningful demand shifts.

Companies already certified by or supplying Huawei (Huaweim 华为) stand to benefit earlier due to compatibility and channel advantages.

Actionable takeaways for investors, founders, and tech leaders

Watch certified suppliers first. Companies already passing Huawei’s (Huaweim 华为) compatibility checks or supplying Ascend servers have a head start.
Assess main control chip roadmaps. Vendors supporting 36-layer DOB and PCIe 5.0 are strategically positioned for high-density AI SSD designs.
Consider cooling and packaging. High-frequency AI SSDs raise thermal challenges; cooling suppliers with data center-grade liquid or ceramic solutions become more strategic.
Channel advantages matter. Distributors with exclusive Huawei (Huaweim 华为) ties or strong coverage in finance/telecom are likely winners in enterprise replacement cycles.

Key Investment Considerations – Summary

Certified Suppliers: Prioritize companies with existing Huawei compatibility or supply history for Ascend servers.
Main Control Chips: Focus on vendors supporting advanced technologies like 36-layer Die-on-Base (DOB) and PCIe 5.0 for AI SSD designs.
Cooling Solutions: Evaluate suppliers offering robust thermal management, especially data center-grade liquid or ceramic solutions for high-frequency AI SSDs.
Channel Partners: Identify distributors with strong, exclusive ties to Huawei or significant market penetration in key enterprise segments (finance, telecom).
Capacity vs. Bandwidth: Understand the shifting balance between the need for high bandwidth (HBM) and high capacity/cost-efficiency (AI SSD) for different AI workloads.
Localized Ecosystem: Recognize Huawei’s strategic intent to build a domestic AI storage ecosystem and its implications for the supply chain.

Quick summary

Huawei (Huaweim 华为) plans to launch an AI SSD on August 27, 2025, targeting capacity-driven AI workloads and aiming to bolster a localized storage ecosystem.

The move could reshape demand across storage equipment suppliers, main control chip makers, cooling technology providers, and distribution channels.

Watch supplier certifications, main control chip support, and cooling innovations to understand where value will accrue as the market adapts.

Huawei AI SSD